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surface mount device package

См. также в других словарях:

  • Dual in-line package — DIP, o Dual in line package por sus siglas en inglés, es una forma de encapsulamiento común en la construcción de circuitos integrados. La forma consiste en un bloque con dos hileras paralelas de pines, la cantidad de éstos depende de cada… …   Wikipedia Español

  • Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips …   Wikipedia

  • Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 …   Wikipedia

  • Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads …   Wikipedia

  • Charge-coupled device — A specially developed CCD used for ultraviolet imaging in a wire bonded package. A charge coupled device (CCD) is a device for the movement of electrical charge, usually from within the device to an area where the charge can be manipulated, for… …   Wikipedia

  • Apollo 15, Lunar surface — Apollo 15 Commander David Scott and Lunar Module Pilot James Irwin spent three days on the Moon and a total of 18½ hours outside the spacecraft on lunar extra vehicular activity. The mission was the first not to land in a lunar mare, instead… …   Wikipedia

  • Transistor — For other uses, see Transistor (disambiguation). Assorted discrete transistors. Packages in order from top to bottom: TO 3, TO 126, TO 92, SOT 23 A transistor is a semiconductor device used to amplify and switch electronic signals and power. It… …   Wikipedia

  • Resistor — A typical axial lead resistor Type Passive Working principle Electrical resistance Invented Ge …   Wikipedia

  • Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… …   Wikipedia

  • Tecnología de montaje superficial — Varios dispositivos SMD. La tecnología de montaje superficial, más conocida por sus siglas en inglés SMT (Surface Mount Technology) es el método de construcción de dispositivos electrónicos más utilizado actualmente. Se usa tanto para componentes …   Wikipedia Español

  • Printed circuit board — Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to… …   Wikipedia

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